Semiconductor units sit in Gujarat, Assam, Odisha and at Jewar in Uttar Pradesh; Madhya Pradesh hosts none, and a neighbouring-state substitution is the usual trap.
(c) HCL-Foxconn Joint Venture India Chip Ltd. — Madhya Pradesh
The question asks for the pair that is not correctly matched.
The incorrect pair is:
HCL-Foxconn Joint Venture India Chip Ltd. — Madhya Pradesh
The HCL-Foxconn joint venture semiconductor unit, India Chip Ltd., is being set up near Jewar Airport in the Yamuna Expressway Industrial Development Authority region, Uttar Pradesh, not Madhya Pradesh. The Union Cabinet approved this unit in May 2025 under the India Semiconductor Mission. (Press Information Bureau)
| Option | Pair Given | Actual Location | Verdict |
|---|---|---|---|
| (a) | CG Power and Industrial Solutions with Renesas and STARS Microelectronics — Gujarat | Sanand, Gujarat | Correct |
| (b) | Tata Semiconductor Assembly and Test Pvt. Ltd. — Assam | Morigaon, Assam | Correct |
| (c) | HCL-Foxconn Joint Venture India Chip Ltd. — Madhya Pradesh | Jewar / YEIDA, Uttar Pradesh | Incorrect |
| (d) | SicSem Pvt. Ltd. — Odisha | Odisha | Correct |
Hence, the correct answer is (c).
| Option | Verdict | Explanation |
|---|---|---|
| (a) | Incorrect option | This pair is correctly matched. CG Power, in partnership with Renesas and STARS Microelectronics, is establishing a semiconductor facility in Sanand, Gujarat. (Press Information Bureau) |
| (b) | Incorrect option | This pair is correctly matched. Tata Semiconductor Assembly and Test Pvt. Ltd. is setting up its facility in Morigaon, Assam. (Press Information Bureau) |
| (c) | Correct option | This pair is not correctly matched. HCL-Foxconn’s India Chip Ltd. plant is located near Jewar Airport, Uttar Pradesh, not Madhya Pradesh. (Press Information Bureau) |
| (d) | Incorrect option | This pair is correctly matched. SiCSem and 3D Glass semiconductor projects are to be set up in Odisha. (Press Information Bureau) |
| Project / Company | Location | State | Broad Type / Focus |
|---|---|---|---|
| CG Power and Industrial Solutions with Renesas and STARS Microelectronics | Sanand | Gujarat | OSAT / semiconductor assembly and testing |
| Tata Semiconductor Assembly and Test Pvt. Ltd. | Morigaon | Assam | Semiconductor assembly and testing |
| HCL-Foxconn Joint Venture India Chip Ltd. | Near Jewar Airport / YEIDA | Uttar Pradesh | Display driver chips / semiconductor unit |
| SiCSem Pvt. Ltd. | Odisha | Odisha | Silicon carbide / compound semiconductor ecosystem |
| 3D Glass Solutions | Odisha | Odisha | Advanced packaging / glass substrate-related semiconductor project |
| ASIP Technologies | Andhra Pradesh | Andhra Pradesh | Semiconductor manufacturing / packaging |
| CDIL | Punjab | Punjab | Semiconductor components / discrete semiconductors |
| Company / Project | Location | State | Type / Focus Area | Status / Importance |
|---|---|---|---|---|
| Micron Technology | Sanand | Gujarat | ATMP facility | One of India’s major semiconductor assembly, testing, marking and packaging projects |
| Tata Electronics with PSMC, Taiwan | Dholera | Gujarat | Semiconductor fabrication plant | India’s major chip fabrication project |
| CG Power and Industrial Solutions with Renesas and STARS Microelectronics | Sanand | Gujarat | OSAT facility | One of India’s first end-to-end OSAT pilot line facilities |
| Tata Semiconductor Assembly and Test Pvt. Ltd. | Morigaon | Assam | Assembly and testing facility | Major semiconductor project in North-East India |
| Kaynes Semicon Pvt. Ltd. | Sanand | Gujarat | OSAT facility | Semiconductor assembly and testing project |
| HCL-Foxconn JV / India Chip Ltd. | Jewar / YEIDA region | Uttar Pradesh | Semiconductor unit for display driver chips | Not in Madhya Pradesh; this was the incorrect pair in the question |
| SiCSem Pvt. Ltd. | Bhubaneswar | Odisha | Silicon carbide / compound semiconductor project | Important for power electronics and advanced semiconductor ecosystem |
| 3D Glass Solutions | Bhubaneswar | Odisha | Advanced packaging / glass substrate-related semiconductor project | Important for next-generation chip packaging |
| CDIL | Mohali | Punjab | Discrete semiconductor components | Supports domestic semiconductor component manufacturing |
| ASIP Technologies | Andhra Pradesh | Andhra Pradesh | Semiconductor packaging / system-in-package technologies | Supports advanced packaging ecosystem |
The India Semiconductor Mission lists the HCL-Foxconn project as India Chip at YEIDA, Jewar, Uttar Pradesh, while PIB’s SEMICON India 2025 note lists CG Power at Sanand, Gujarat, Tata Semiconductor Assembly and Test at Morigaon, Assam, and SiCSem at Bhubaneswar, Odisha. (Indian Statistical Manual)
| Given in Question | Correct Fact |
|---|---|
| HCL-Foxconn Joint Venture India Chip Ltd. — Madhya Pradesh | HCL-Foxconn Joint Venture India Chip Ltd. — Uttar Pradesh |
| Location mentioned as Madhya Pradesh | Actual location: near Jewar Airport, YEIDA region, Uttar Pradesh |
| Point | Explanation |
|---|---|
| HCL-Foxconn = Jewar, Uttar Pradesh | Not Madhya Pradesh; this was the trap in the question. |
| CG Power-Renesas-STARS = Sanand, Gujarat | Important OSAT project. |
| Tata Semiconductor Assembly and Test = Morigaon, Assam | Major semiconductor project in the North-East. |
| SiCSem = Bhubaneswar, Odisha | Linked with compound semiconductor ecosystem. |
| Gujarat is emerging as a major semiconductor hub | Sanand and Dholera host multiple major semiconductor projects. |
| State | Important Projects | Broad Significance |
|---|---|---|
| Gujarat | Micron, Tata Electronics-PSMC, CG Power-Renesas-STARS, Kaynes Semicon | India’s strongest emerging semiconductor manufacturing cluster |
| Assam | Tata Semiconductor Assembly and Test Pvt. Ltd. | Major semiconductor assembly and testing hub in North-East India |
| Uttar Pradesh | HCL-Foxconn / India Chip Ltd. at Jewar | Important for display driver chips and electronics ecosystem near Noida-Jewar region |
| Odisha | SiCSem Pvt. Ltd., 3D Glass Solutions | Focus on compound semiconductors and advanced packaging |
| Punjab | CDIL, Mohali | Discrete semiconductor and component manufacturing |
| Andhra Pradesh | ASIP Technologies | Advanced packaging and system-in-package ecosystem |
| Term | Meaning | Simple Understanding |
|---|---|---|
| Fab | Semiconductor fabrication plant | Makes chips on wafers |
| ATMP | Assembly, Testing, Marking and Packaging | Post-fabrication processing of chips |
| OSAT | Outsourced Semiconductor Assembly and Test | Third-party chip packaging and testing service |
| Compound Semiconductor | Semiconductor made from two or more elements | Used in power electronics, EVs, defence and telecom |
| Silicon Carbide | A compound semiconductor material | Useful for high-power, high-temperature applications |
| Display Driver Chip | Chip that controls display panels | Used in phones, TVs, laptops and automotive displays |
| Wafer | Thin slice of semiconductor material | Base on which chips are fabricated |