Both statements are correct.
| Parameter | Details |
|---|
| Name | DHRUV64 |
| Developed by | Centre for Development of Advanced Computing, C-DAC |
| Programme | Digital India RISC-V Programme / Microprocessor Development Programme |
| Architecture | RISC-V based |
| Type | 64-bit dual-core microprocessor |
| Clock Speed | 1.0 GHz |
| Status | India’s first homegrown 1.0 GHz, 64-bit dual-core microprocessor |
| Order under DIR-V fabrication | Third chip |
| Earlier DIR-V chips | THEJAS32 and THEJAS64 |
| Broad Applications | Telecom, IoT, industrial automation, automotive electronics, strategic systems |
THEJAS32 was the first India-designed DIR-V chip to be fabricated, THEJAS64 was the second, and DHRUV64 is the third.
| Point | Explanation |
|---|
| DHRUV64 is the key current fact | It is India’s first homegrown 1.0 GHz, 64-bit dual-core microprocessor. |
| DIR-V sequence matters | The sequence is THEJAS32 → THEJAS64 → DHRUV64. |
| RISC-V is important | It is an open-standard architecture, helping India build sovereign processor capability. |
| C-DAC and IITs are key players | C-DAC developed VEGA/DHRUV64, while IIT Madras developed SHAKTI and IIT Bombay developed AJIT. |
| Chip design and chip fabrication are different | India may design chips domestically, while fabrication may happen domestically or abroad depending on capability. |
| Microprocessor / Chip | Developed By | Architecture / Type | Key Feature | Relevance |
|---|
| DHRUV64 | C-DAC | RISC-V, 64-bit dual-core | India’s first homegrown 1.0 GHz, 64-bit dual-core microprocessor | Important for indigenous semiconductor capability |
| THEJAS32 | C-DAC | RISC-V, 32-bit | First chip fabricated under DIR-V programme | Early milestone in India’s RISC-V processor journey |
| THEJAS64 | C-DAC | RISC-V, 64-bit single-core | Second chip fabricated under DIR-V programme | Intermediate milestone before DHRUV64 |
| SHAKTI | IIT Madras | RISC-V processor family | Indigenous processor ecosystem with multiple variants | Used for academic, embedded and strategic applications |
| VEGA | C-DAC | RISC-V processor family | Indigenous processor family for embedded and IoT applications | Supports India’s microprocessor development efforts |
| AJIT | IIT Bombay | SPARC-based processor | India’s first indigenously developed processor from academia | Important older milestone in processor design |
| Initiative / Programme | Nodal Ministry / Institution | Purpose | Relevance |
|---|
| Digital India RISC-V Programme / DIR-V | Ministry of Electronics and IT | Build indigenous RISC-V microprocessors | Supports domestic processor design ecosystem |
| Microprocessor Development Programme | MeitY | Develop indigenous microprocessors | Reduces dependence on imported processors |
| India Semiconductor Mission | MeitY | Build semiconductor and display manufacturing ecosystem | Supports fabrication, design and packaging ecosystem |
| Design Linked Incentive Scheme | MeitY | Support semiconductor design companies | Encourages chip design start-ups and domestic IP |
| Production Linked Incentive for Electronics | MeitY | Boost electronics manufacturing | Strengthens electronics value chain |
| SPECS Scheme | MeitY | Promote manufacturing of electronic components and semiconductors | Supports domestic component ecosystem |
| Semicon India Programme | Government of India | Develop sustainable semiconductor ecosystem | Supports fabs, ATMP/OSAT units and chip design |
| Term | Meaning | Simple Understanding |
|---|
| Microprocessor | A central processing unit on a chip | The “brain” that processes instructions |
| Microcontroller | Processor plus memory and input-output units on one chip | Used in embedded devices and appliances |
| RISC-V | Open-standard instruction set architecture | Blueprint for designing processors |
| ISA | Instruction Set Architecture | Language between software and processor hardware |
| Fabrication | Manufacturing chips on semiconductor wafers | Physical making of the chip |
| Foundry | Facility that manufactures chips | Example: semiconductor fabrication plant |
| Fabless company | Designs chips but outsources manufacturing | Common model in chip design industry |
| ATMP / OSAT | Assembly, testing, marking and packaging | Post-fabrication processing of chips |
| Wafer | Thin slice of semiconductor material | Base material on which chips are built |